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# Technological Data Definition (Default Foundry) C_TECH

### Symbol :

### Parameters :

> die_h0 = Height of dielectric for air bridges (for simulation only)
> die_er0 = Relative permittivity of dielectric layer for air bridges (for simulation only)
> die_td0 = Dielectric loss factor of dielectric layer for bridges (for simulation only)
> cap_os1 = Oversize of bottom metal-plate of MIM capacitors with dielectric layer
> cap_l1 = Length of the connection region of MIM capacitors with dielectric layer 1
> die_h1 = Height of dielectric layer 1 (for simulation only)
> die_er1 = Relative permittivity of dielectric layer1 (for simulation only)
> die_td1 = Dielectric loss factor of dielectric layer 1 (for simulation only)
> cap_os2 = Oversize of bottom metal-plate of MIM capacitors with dielectric layer 2
> cap_l2 = Length of the connection region of MIM capacitors with dielectric layer 2
> die_h2 = Height of dielectric layer 2 (for simulation only)
> die_er2 = Relative permittivity of dielectric layer 2 (for simulation only)
> die_td2 = Dielectric loss factor of dielectric layer 2 (for simulation only)
> res_l = Length of the connection region for resistors
> res_rs = Sheet resistivity of resistive layer (ohm/square) (for simulation only)
> t1 = Thickness of metal level 1 (cond) (for simulation only)
> rho1 = Resistivity of metal level 1 (cond) (for simulation only)
> t2 = Thickness of metal level 2 (cond2) (for simulation only)
> rho2 = Resistivity of metal level 2 (cond2) (for simulation only)

### Range of Usage :

> die_hn 5DL* < die_hn < 0.2 DL* (for n=0,1,2)
> die_ern ³ 1 (for n=0,1,2)
> cap_osn ³ 0 (for n=1,2)
> cap_ln ³ 0 (for n=1,2)
> res_l ³ 0
> tn 5DL* < tn < 0.2 DL* (for n=1,2)
> * ) see C_GRID for information on DL

### Notes/Equations/References :

> 1. In this data item, the process data of a so called DEFAULT foundry are stored. This is an arbitrary foundry and the parameter can be modified by user.
> 2. In the DEFAULT foundry, there are three two metal layers, three dielectric layers, and a resistive layer.
> 3. If only the DEFAULT foundry is available (standard packet of COPLAN for ADS), the only name for C_TECH allowed is "C_TECH_DEFAULT". Use of another name causes the simulator to abort!
> 4. The parameters die_h0, die_er0 and die_td0 represent the definition of dielectric layer which is used in air bridges (C_AIRTYP) addressed by the parameter DIE_IDX. The use of these layer for C_MIM and C_CAPLIN is not allowed.
> 5. The parameters die_hn, die_ern, die_tdn, cap_osn and cpa_ln (n=1,2) represent the definition of dielectric layers used in capacitors (C_CAPLIN and C_MIM) addressed by the parameter DIE_IDX. For example if DIE_IDX in C-MIM is set to 1, a dielectric layer of thickness die_h1 and dielectric constant of die_er1 and loss tangent of die_td1 is used for the capacitor. In this case, cap_os1 is the oversize of the bottom plate and cap_l1 is the length of connection region. These two dielectric layers can also be used for air-bridges; however in this case the parameter cap_osn and cap_ln (n=1,2) are ignored.
> 6. The parameters res_l and res_rs represent the definition of resistive layers for resistor elements C_TFR and C_TFG addressed by the parameter RES_ IDX.
> 7. The parameters t1, rho1 and t2, rho2 represent the definition of metal layers addressed by CEN_MET, GDN_MET or LEVEL (see C_LINTYP, C_NL_TYP, C_IDC, C_RIND).
> 8. roh1 and roh2 are specific resistivity of metal layers 1 and 2 related to Gold. For perfect gold, this value is 1.
> 9. The value for metallization thickness tn (n=1,2) and dielectric height die_hn (n=0,1,2,...) does not depend on the grid size. However, for these two parameters, the ratio tn/DL and die_hn /DL should be between 0.2 and 5.0. Otherwise, the accuracy of the simulation can not be guaranteed.

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